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TCD1304DG
TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device)
Preliminary
TCD1304DG
The TCD1304DG is a high sensitive and low dark current 3648 -elements linear image sensor. The sensor can be used for POS scanner. The device consist of sensitivity CCD chip. The TCD1304DG has electronic shutter function (ICG). Electronic shutter funtion can keep always output voltage constant that vary with intensity of lights.
FEATURES
Pixel Number Pixel Size : 3648 : 8mx200m Weight: (3.5g (Typ.))
Photo Sensing Region : High Sensitive & Low Dark Current pn Photodiode Internal Circuit : CCD Drive Circuit Power Supply Function Package : Only 3.0V Drive (MIN.) : Electronic Shutter Sample and Hold Circuit : 22 Pin CERDIP PACKAGE
PIN CONNECTION
MAXIMUM RATINGS (Note 1)
CHARACTERISTIC Master Clock Pulse Voltage SH Pulse Voltage ICG Pulse Voltage Digital Power Supply Analog Power Supply Operating Temperature Storage Temperature SYMBOL VM VSH VICG VDD VAD Topr Tstg -25~60 -40~100 C C -0.3~7 V RATING UNIT
Note:
All voltage are with respect to SS terminals. (Ground)
(TOP VIEW)
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TCD1304DG
CIRCUIT DIAGRAM
PIN NAMES
M
Master Clock Shift Gate Integration Clear Gate Power (Analog) Power (Digital) Ground Non Connection
SH ICG VAD VDD SS NC
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TCD1304DG
OPTICAL / ELECTRICAL CHARACTERISTICS
(Ta = 25 V = 4.0V (PULSE), f = 0.5MHz, tINT (INTEGRATION TIME) = 10ms, LOAD C, RESISTANCE = 100k , VAD = VDD = 4.0V, LIGHT SOURCE = DAYLIGHT FLUORESCENT LAMP)
CHARACTERISTIC Sensitivity Photo Response Non Uniformity Register Imbalance Saturation Output Voltage Dark Signal Voltage Total Transfer Effeiciency Dynamic Range Saturation Exposure DC Power Dissipation DC Signal Output Voltage Output Impedance Image Lag of Electronic Shutter SYMBOL R PRNU RI VSAT VMDK TTE DR SE PD VOS Zo VLAGICG MIN 110 450 92 1.5 TYP. 160 600 2 95 300 0.004 25 2.5 0.5 MAX 10 3 5 75 3.5 1.0 10 UNIT V / lx*s % % mV mV % lx*s mW V k mV Tint=100s (Note 8) (Note 6) (Note 7) (Note 2) (Note 3) VOD = 3.0V (Note 4) (Note 5) NOTE
Note 2: Measured at 50% of SE (Typ.) Definition of PRNU: PRNU =
x 100(%)
Where is average of total signal outputs and is the maximum deviation from under uniform illumination. Note 3: Measured at 50% of SE (Typ.) RI is defined as follows:
3647 n - n + 1 RI = n=1 x 100(%) 3647*
Where n and n+1 are signal outputs of each pixel. is average of total signal outputs. Note 4: VSAT is defined as minimum saturation output voltage of all effective pixels. Note 5: VMDK is defined as maximum dark signal voltage of all effective pixels.
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Note 6: Definition of DR : DR =
VSAT VMDK
VMDK is proportional to tINT (Integration time). So the shorter tINT condition makes wider DR value. Note 7: Definition of SE : SE =
VSAT (lx*s) R
Note 8: DC signal output voltage is defined as follows: .
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OPERATING CONDITION
CHARACTERISTIC Master Clock Pulse Voltage "H" Level "L" Level SH Pulse Voltage "H" Level "L" Level ICG Pulse Voltage Digital Power Supply Analog Power Supply "H" Level "L" Level SYMBOL VM MIN 3.0 0 3.0 0 3.0 0 3.0 3.0 TYP. 4.0 0 4.0 0 4.0 0 4.0 4.0 MAX 5.5 0.44 5.5 0.44 5.5 0.44 5.5 5.5 V V V V UNIT V
VSH
VICG VDD VAD
Note:
VAD = VDD MAX. Voltage of Pulse Voltage "H" Level = VDD MIN. Voltage of Pulse Voltage "H" Level = VDD-0.5V
CLOCK CHARACTERISTICS (Ta = 25C) (VAD = VDD4.0V)
CHARACTERISTIC Master Clock Frequency Data Rate Master Clock Capacitance Shift Pulse Capacitance ICG Pulse Capacitance SYMBOL fM fDATA CM CSH CICG MIN 0.8 0.2 TYP. 2 0.5 10 600 250 MAX 4 1 UNIT MHz MHz pF pF pF
CLOCK CHARACTERISTICS (Ta = 25C) (4.0V>VAD = VDD3.0V)
CHARACTERISTIC Master Clock Frequency Data Rate SYMBOL fM fDATA MIN 0.8 0.2 TYP. 2 0.5 MAX 2.4 0.6 UNIT MHz MHz
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TIMING CHART
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TCD1304DG
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TCD1304DG-6
TIMING CHART (Use electric shutter function)
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TCD1304DG-7
TCD1304DG
TIMING REQUIREMENTS
CHARACTERISTIC ICG Pulse DELAY Pulse Timing of ICG and S H SH Pulse Width Pulse Timing of ICG and M
SYMBOL t1 t2 t3 t4
MIN 1000 100 1000 0
TYP. 5000 500 20
MAX 1000 *
UNIT ns ns ns ns
*: Note:
You keep M "High" Level. If you use electronic shutter function. tINT (MIN.) = 10s
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USE ELECTRONIC SHUTTER
Pulse Timing of SH and ICG * SH cycle = Tint
tINT (MIN.) = 10s You have always same SH pulse width (t3).
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TYPICAL PERFOMANCE CURVES
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TYPICAL PERFOMANCE CURVES
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TCD1304DG
TYPICAL DRIVE CIRCUIT
TCD1304D
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CAUTION
1. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage.
2.
Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range.
3.
Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor.
4.
Lead Frame Forming
Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB.
5.
Soldering
Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C.
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TCD1304DG
PACKAGE DIMENSIONS
Unit : mm
Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) Weight: (3.5g (Typ.))
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TCD1304DG
RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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